AMTECH Solder Spheres Sn96.5/Ag3.0, Cu0.5 Special Sizes High boiling point engineered fluid designed for lead-free and tin-lead

designed for lead-free and tin-lead alloys

Viscosity - Malcom @ 10 RPM/25 °C (x103mPa/s)- Sn63/Pb37 T3/T4

Viscosity - Malcom @ 10 RPM/25 oC (x103mPa/s)- Sn63 T3/T4

Aqueous system (Immersion or spray)

Solder paste should be stored between 3-8 °C (37-46 °F) to obtain the maximum refrigerated shelf life of twelve months

AMTECH Solder Spheres Sn96.5/Ag3.0, Cu0.5 Special Sizes High boiling point engineered fluid designed for lead-free and tin-leadTechnical Data Sheet Safety Data Sheet AMTECH BGA Solder Spheres are manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages. AMTECH spheres also exceed both IPC and MIL standards for purity levels and size tolerances. Normal sizes are from 3 mil to 35 mil and custom solder sphere sizes are available upon request. Other alloys are available upon request. Data Table Element Inspect to (% wt) Element